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HARDWARE VIOLATION MONITOR OF TRANSACTION LEVEL REAL-TIME CONSTRAINTS FOR RELIABLE SYSTEMS ON A CHIP

Pavel Kustarev

First published: 2014-06-20https://doi.org/10.5593/sgem2014/b21/s7.026View metrics

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Title
HARDWARE VIOLATION MONITOR OF TRANSACTION LEVEL REAL-TIME CONSTRAINTS FOR RELIABLE SYSTEMS ON A CHIP
Authors
Pavel Kustarev
Proceedings
14th International Multidisciplinary Scientific GeoConference SGEM 2014, Geoinformatics, Remote Sensing, and Artificial Intelligence, Vol. 14, Book 2, Volume 1
Publisher
Stef92 Technology
Year
2014
Pages
Not available yet
ISSN
1314-2704
ISBN
Not available yet
Language
en
Publication type
Conference Paper
Proceedings volume
14th International Multidisciplinary Scientific GeoConference SGEM 2014, Geoinformatics, Remote Sensing, and Artificial Intelligence, Vol. 14, Book 2, Volume 1 · Issue Book 2, Volume 1
References6
  1. Asadi N., Saadatmand M., Sjodin M. Run-Time Monitoring of Timing Constraints : A Survey of Methods and Tools, ICSEA 2013: The Eighth International Conference on Software Engineering Advances, pp. 391-401, 2013.

  2. Boule M., Chenard J., Zilic Z. Adding Debug Enhancements to Assertion Checkers for Hardware Emulation and Silicon Debug, Computer Design, ICCD 2006, International Conference on, Canada, pp. 294-299, 2007.

  3. Boule M., Chenard J., Zilic Z. Assertion Checkers in Verification, Silicon Debug and In-Field Diagnosis, Quality Electronic Design, ISQED '07 8th International Symposium on, Canada, pp. 613-620, 2007.

  4. Shobaki M. On-Chip Monitoring of Single- and Multiprocessor Hardware Real- Time Operating Systems, In 8th International Conference on Real-Time Computing Systems and Applications. IEEE, 2002.

  5. Ciordas C., Basten T., Radulescu A., Goossens K., Meerbergen J. An event-based network-on-chip monitoring service, High-Level Design Validation and Test Workshop, Ninth IEEE International, Netherlands, pp. 149-154, 2004.

  6. Tsai J.J.-P., Fang K.-Y., Horng-Yuan Chen. A noninvasive architecture to monitor real-time distributed systems, Computer, USA, vol. 23, no. 3, pp.11-23, 1990.

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