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MINIATURIZATION AS A WAY TO PRESERVE MATERIAL IN THE MANUFACTURE OF MICROSTRIP DEVICES

Denis A. Letavin

Abstract

Microstrip devices have found wide application in various fields of radio engineering. However, such devices are made on dielectric substrates from various materials - glass,mica, ceramics, etc. In the process of manufacturing microstrip devices, it is possible to use, as etching method, this removal of excess copper coating, and removal of copper coating with special equipment, for example a milling machine . As a result, at various stages of manufacturing, material waste remains in large quantities, a solution for etching, milling the milling cutter and many other things are consumed. In order to reduce the amount of waste and the total amount of material used, it is proposed to use the miniaturization method, which, through more efficient use of the substrate area, minimizes the cost of producing microstrip devices. Modeling was carried out in the program for electrodynamics analysis of radio electronic devices in the NI-AWR Design Environment program 13. In this paper, a miniature crossover was developed,the dimensions of which were reduced by meta-structures by 70.1% compared to the dimensions of a traditional design, while maintaining characteristics in a wide band of operating frequencies.

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DOI resolver: doi.org/10.5593/sgem2018/6.1/s24.039

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