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MECHANISM OF FORMATION OF A HIGHLY ADHESIVE METAL LAYER TO THE POLYMER SURFACE
Abstract
Interest in polymer materials with a metallized coating is growing every day. Polyimide (PI) with high heat-resistant properties and a low coefficient of thermal expansion is one of the promising materials for metallization. Polyimide metallized films are used as highly reflective materials for space technologies, and they are also used to produce materials for adaptive and flexible optical devices. Polyimides have good dielectric properties. The process of metallization of polyimide films is studied and the optimal conditions for conducting alkaline hydrolysis and chelation in aqueous solutions of metal salts are selected. The presented method of metallization does not injure the surface of the film, it is quite simple, and the films obtained by this method have high surface electrical and optical characteristics. Theoretical analysis and a physical model show that the development of the relief and modification of the surface of the polymer film allow us to solve the problem of forming a structure with high metal-to-polymer adhesion. The adhesion is mainly provided by the Van der Waals forces, and due to the formation of a double electric layer at the interface of a highly developed terrain. The process of metallization of polyimide films is studied and the optimal conditions for conducting alkaline hydrolysis, chelation in aqueous solutions of metal salts, and reduction in an aqueous solution of copper with the formation of a metal layer are selected.
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