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THE EFFECT OF HEATING TEMPERATURE ON THE MECHANISM OF STRAIN RATE OF POLYIMIDE FILMS
Abstract
The features of the influence of thermal fields on the deformation of polyimide films are investigated. It has been established that the effect of static load up to 50% Fmax leads to the structuring of polyimide films, and starting with F ? 70% Fmax, amplifications of destruction processes in them are caused. Heating to 433 K and the application of a load leads to the structuring of macromolecules of polyimide in the direction of the impact of the load, leading to linear growths of relative elongation and an increase in the maximum strain rate. An increase in temperature above 453 K and the effects of similar loads lead to a change in the nature of the growth of the relative elongation of the polyimide film: in the load range from ~ 55% Fmax to 70% Fmax, deviations from linearity of the increase in relative elongation and increase in the maximum strain rate caused by the transformation of the pattern of polymer macromolecules from - due to rupture of bonds between adjacent polymer macromolecules; with the application of loads over 70% ?max, a more rapid linear increase in the relative elongation and strain rate caused by an increase in the distances between the atoms in the macromolecules, ending with ruptures of the bonds between the atoms and generally breaking the film.
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