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STUDY OF THE DEPENDENCE OF BENDING RESISTANCE IN CORRELATION TO TEMPERATURE OF A CONDUCTIVE MATERIAL
Abstract
In special applications it is necessary to correlate the obtained data about the state of a process in which the Joule effect is involved by passing an electric current through a conductive material. The multiplier effect due to increased resistance with temperature may require particular attention in monitoring the process, thus requiring automatic decision-making processes so that the modification of the conductive material properties does not affect the entire chain of the process. We propose a system for monitoring and correlation of temperature with modification of bending resistance of a conductor, information obtained from sensors and transducers in analog format, but transformed in binary format to facilitate the processing of the obtained information. With a contactless infrared temperature sensor and a force sensor we will detect state changes on the considered conductor and the microcontroller system will transmit the data obtained to a PC for processing and analysis. The embedded software in the microcontroller will assess the data provided by the sensors and give the possibility to make the decisions according to specific information.
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